公开(公告)号：US20220113773A1

公开(公告)日：2022-04-14

申请号：US17560630

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Lunyu MA ,  Shahin AMIRI ,  Casey CARTE ,  Mirui WANG ,  Damion SEARLS ,  Tamara J. LOW FOON

IPC: G06F1/18 ,  G06F13/42

Abstract: An apparatus is described. The apparatus includes an add-in card having multiple semiconductor chip packages mounted to a printed circuit board of the add-in card. The add-in card includes separate dedicated heat sinks respectively coupled to the semiconductor chip packages with spring loaded fixturing elements, a heat pipe coupled to a plurality of the heat sinks.