公开(公告)号：US20220012396A1

公开(公告)日：2022-01-13

申请号：US17484647

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Navneeth Jayaraj ,  Chetan Maheshwari ,  Reed Vilhauer ,  Dustin Fredrickson

IPC: G06F30/34

Abstract: Systems and methods described herein may relate to power inlet reconfiguration of an integrated circuit device. In an embodiment, an add in card includes an integrated circuit including programmable logic circuitry. The add in card also includes any number of voltage regulators configured to supply power to the integrated circuit and a controller. The controller configures the programmable logic circuitry based on a configuration profile, determine a power level associated with the configuration profile, and adjust the plurality of voltage regulators and load switches based on the power level.

公开(公告)号：US20230225084A1

公开(公告)日：2023-07-13

申请号：US17957457

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Shreekanth Murthy Muthigi ,  Casey Winkel ,  Chetan Maheshwari

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K7/2039 ,  G06F1/20 ,  H05K1/0201

Abstract: Methods and apparatus are disclosed to cool hardware. An example apparatus to cool a hardware component includes a first substrate; a second substrate couplable to a chassis, the second substrate formed of a metal; and a plurality of malleable fins coupled between the first and second substrates, the malleable fins formed of a thermally conductive material.