公开(公告)号：US20240351892A1

公开(公告)日：2024-10-24

申请号：US18759055

申请日：2024-06-28

Applicant: Intel Corporation

Inventor： Krishnendu Saha ,  Chethan Holla ,  Hari Shanker Thakur

IPC: C01B33/158 ,  C01B33/159 ,  C09D183/04 ,  G06F1/20 ,  H05K5/02

CPC classification number: C01B33/1585 ,  C01B33/159 ,  C09D183/04 ,  G06F1/206 ,  H05K5/02 ,  C01P2006/32

Abstract: Aerogel including low thermal conductivity gases and related apparatus and methods are disclosed. An example aerogel disclosed herein includes a framework including a plurality of pores and a gas in at least one of the plurality of pores, the gas having a lower thermal conductivity than air.