公开(公告)号：US10103037B2

公开(公告)日：2018-10-16

申请号：US14273754

申请日：2014-05-09

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Dilan Seneviratne ,  Charavana K. Gurumurthy ,  Ching-Ping J. Shen ,  Daniel N. Sobieski

IPC分类号： H01L23/053 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L21/78

摘要： Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.