公开(公告)号：US20200227362A1

公开(公告)日：2020-07-16

申请号：US16247312

申请日：2019-01-14

Applicant: Intel Corporation

Inventor： Jonathan W. THIBADO ,  Jeffory L. SMALLEY ,  John C. GULICK ,  Phi THANH ,  Mohanraj PRABHUGOUD ,  Chong ZHAO

IPC: H01L23/66 ,  H05K1/18 ,  H01L23/498 ,  H01L23/34 ,  H01B7/04 ,  G02B6/42 ,  H01B3/30 ,  H01B7/08 ,  H01L25/10 ,  H05K1/02

Abstract: Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.