公开(公告)号：US20210104475A1

公开(公告)日：2021-04-08

申请号：US16596328

申请日：2019-10-08

Applicant: Intel Corporation

Inventor： Kaladhar RADHAKRISHNAN ,  Krishna BHARATH ,  Clive HENDRICKS

IPC: H01L23/64 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments include an inductor, a method to form the inductor, and a semiconductor package. An inductor includes a plurality of plated-through-hole (PTH) vias in a substrate layer, and a plurality of magnetic interconnects with a plurality of openings in the substrate layer. The openings of the magnetic interconnects surround the PTH vias. The inductor also includes an insulating layer in the substrate layer, a first conductive layer over the PTH vias, magnetic interconnects, and insulating layer, and a second conductive layer below the PTH vias, magnetic interconnects, and insulating layer. The insulating layer surrounds the PTH vias and magnetic interconnects. The magnetic interconnects may have a thickness substantially equal to a thickness of the PTH vias. The magnetic interconnects may be shaped as hollow cylindrical magnetic cores with magnetic materials. The magnetic materials may include ferroelectric, conductive, or epoxy materials. The hollow cylindrical magnetic cores may be ferroelectric cores.