公开(公告)号：US20230176873A1

公开(公告)日：2023-06-08

申请号：US17924036

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Min WU ,  Jun ZHANG ,  Yuyang XIA ,  Dan LIU ,  Chao ZHOU ,  Lianchang DU ,  Carrie CHEN ,  Nishi AHUJA ,  Jason CROP ,  Wenqing LV

IPC: G06F9/44 ,  G06F1/20

CPC classification number: G06F9/44 ,  G06F1/20 ,  G06F1/26

Abstract: Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.