公开(公告)号：US20240421025A1

公开(公告)日：2024-12-19

申请号：US18290289

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Lianchang DU ,  Jeffory L. SMALLEY ,  Srikant NEKKANTY ,  Eric W. BUDDRIUS ,  Yi ZENG ,  Xinjun ZHANG ,  Maoxin YIN ,  Zhichao ZHANG ,  Chen ZHANG ,  Yuehong FAN ,  Mingli ZHOU ,  Guoliang YING ,  Yinglei REN ,  Chong J. ZHAO ,  Jun LU ,  Kai WANG ,  Timothy Glen HANNA ,  Vijaya K. BODDU ,  Mark A. SCHMISSEUR ,  Lijuan FENG

IPC: H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01R13/627

Abstract: A semiconductor chip package is described. The semiconductor chip package has a substrate. The substrate has side I/Os on the additional surface area of the substrate. The side I/Os are coupled to I/Os of a semiconductor chip within the semiconductor chip package. A cooling assembly has also been described. The cooling assembly has a passageway to guide a cable to connect to a semiconductor chip's side I/Os that are located between a base of a cooling mass and an electronic circuit board that is between a bolster plate and a back plate and that is coupled to second I/Os of the semiconductor chip through a socket that the semiconductor chip's package is plugged into.

公开(公告)号：US20220196507A1

公开(公告)日：2022-06-23

申请号：US17133554

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Victor POLYANKO ,  Mark BIANCO ,  Bijoyraj SAHU ,  Minh T.D. LE ,  Carlos ALVIZO FLORES ,  Javier AVALOS GARCIA ,  Adriana LOPEZ INIGUEZ ,  Luz Karine SANDOVAL GRANADOS ,  Michael BERKTOLD ,  Damion SEARLS ,  Jin YANG ,  David SHIA ,  Samer MELHEM ,  Jeffrey Ryan CONNER ,  Hemant DESAI ,  John RAATZ ,  Richard DISCHLER ,  Bergen ANDERSON ,  Eric W. BUDDRIUS ,  Kenan ARIK ,  Barrett M. FANEUF ,  Lianchang DU ,  Yuehong FAN ,  Shengzhen ZHANG ,  Yuyang XIA ,  Jun ZHANG ,  Yuan Li ,  Catharina BIBER ,  Kristin L. WELDON ,  Brendan T. PAVELEK

IPC: G01M3/04 ,  G01M3/16 ,  G01M3/20 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

公开(公告)号：US20230176873A1

公开(公告)日：2023-06-08

申请号：US17924036

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Min WU ,  Jun ZHANG ,  Yuyang XIA ,  Dan LIU ,  Chao ZHOU ,  Lianchang DU ,  Carrie CHEN ,  Nishi AHUJA ,  Jason CROP ,  Wenqing LV

IPC: G06F9/44 ,  G06F1/20

CPC classification number: G06F9/44 ,  G06F1/20 ,  G06F1/26

Abstract: Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.