公开(公告)号：US09501112B2

公开(公告)日：2016-11-22

申请号：US14125654

申请日：2013-08-10

Applicant: Intel Corporation

Inventor： Daryl Nelson ,  Kevin Daniel ,  Daniel Chiang ,  Mark Gallina ,  Steven Lofland

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F2200/201

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract translation: 移动平台和方法可以提供诸如片上系统（SoC）的集成电路，热耦合到集成电路的第一散热器和热耦合到第一散热器的相变材料配置。 集成电路可以包括根据占空比以性能突发模式操作集成电路的逻辑，其中性能突发模式导致相变材料在相变材料配置的石墨矩阵内进入液态。