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公开(公告)号:USD864969S1
公开(公告)日:2019-10-29
申请号:US29639752
申请日:2018-03-08
Applicant: Intel Corporation
Designer: Aleksander Magi , David M. Collins
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公开(公告)号:US10177801B2
公开(公告)日:2019-01-08
申请号:US14757983
申请日:2015-12-26
Applicant: Intel Corporation
Inventor: David M. Collins , Douglas Satzger , Michael A. Hyde
IPC: H04B1/3888
Abstract: A flip device case for an electronic device is described herein. The flip device case includes a recess and a border. The recess is to receive the electronic device via an opening in the recess. The border is to be coupled with the recess and includes a plurality of flexible points. Manipulation of the border at one or more of the flexible points is to configure the flip device case in a position.
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公开(公告)号:USD824384S1
公开(公告)日:2018-07-31
申请号:US29550448
申请日:2016-01-04
Applicant: INTEL CORPORATION
Designer: Aleksander Magi , David M. Collins , Yishan Chang , Nicholas W. Oakley , Randall W. Martin , Douglas Satzger
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公开(公告)号:USD913215S1
公开(公告)日:2021-03-16
申请号:US29695842
申请日:2019-06-21
Applicant: Intel Corporation
Designer: David M. Collins , Duck Young Kong , Quinn Fitzgerald
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公开(公告)号:US20200371563A1
公开(公告)日:2020-11-26
申请号:US16988851
申请日:2020-08-10
Applicant: Intel Corporation
Inventor: David M. Collins , Brett True Branch , Shashi R. Karpur , Samarth Alva , Yogesh Channaiah
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a carrier plate, and a base. A first hinge can rotatably couple the first housing to the second housing and a carrier plate to the first housing and to the second housing. A second hinge can rotatably couple the carrier plate to the base.
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公开(公告)号:USD895609S1
公开(公告)日:2020-09-08
申请号:US29630874
申请日:2017-12-22
Applicant: Intel Corporation
Designer: Stephen D. Berry , David M. Collins , Randall W. Martin
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公开(公告)号:USD771034S1
公开(公告)日:2016-11-08
申请号:US29531727
申请日:2015-06-29
Applicant: Intel Corporation
Designer: Douglas Satzger , David M. Collins , Gadi Amit , Yoshikazu Hoshino , Maura Hoven , Jinwoo Kim , Luke D. Mastrangelo , Kebei Li
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公开(公告)号:USD1020731S1
公开(公告)日:2024-04-02
申请号:US29696432
申请日:2019-06-27
Applicant: Intel Corporation
Designer: David M. Collins
Abstract: FIG. 1 is a front, right perspective view of a bottom of a computer in a closed position. The side panels of the display are folded around the base of the computer.
FIG. 2 is a top view of the computer of FIG. 1.
FIG. 3 is a bottom view of the computer of FIG. 1.
FIG. 4 is a front view of the computer of FIG. 1.
FIG. 5 is a rear view of the computer of FIG. 1.
FIG. 6 is a top, front, right perspective view of the computer of FIG. 1 in a first open position with the side panels in a fully unfolded position.
FIG. 7 is a top view of the computer of FIG. 6.
FIG. 8 is a bottom view of the computer of FIG. 6.
FIG. 9 is a front view of the computer of FIG. 6.
FIG. 10 is a rear view of the computer of FIG. 6.
FIG. 11 is a top, front, right perspective view of the computer of FIG. 1 in a second open position with the side panels of the display slightly folded.
FIG. 12 is a top view of the computer of FIG. 11.
FIG. 13 is a bottom view of the computer of FIG. 11.
FIG. 14 is a front view of the computer of FIG. 11; and,
FIG. 15 is a rear view of the computer of FIG. 11.
The broken lines and surfaces between the broken lines show portions of the computer with a wrap around display that form no part of the claimed design.-
公开(公告)号:USD926751S1
公开(公告)日:2021-08-03
申请号:US29658429
申请日:2018-07-31
Applicant: Intel Corporation
Designer: David M. Collins
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公开(公告)号:USD861671S1
公开(公告)日:2019-10-01
申请号:US29655625
申请日:2018-07-05
Applicant: Intel Corporation
Designer: David M. Collins , Randall W. Martin
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