公开(公告)号：US20180019213A1

公开(公告)日：2018-01-18

申请号：US15546958

申请日：2015-03-11

Applicant: Intel Corporation

Inventor： Rajendra C. DIAS ,  Tatyana N. ANDRYUSHCHENKO ,  Mauro J. KOBRINSKY ,  Aleksandar ALEKSOV ,  David W. STAINES

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device and methods for forming a microelectronic device. In an embodiment, the microelectronic device includes a semiconductor die that has one or more die contacts that are each electrically coupled to a contact pad by a conductive trace. The semiconductor die may have a first elastic modulus. The microelectronic device may also include an encapsulation layer over the semiconductor die and the conductive trace. The encapsulation layer may have a second elastic modulus that is less than the first elastic modulus. The microelectronic device may also include a first strain redistribution layer within the encapsulation layer. The first strain redistribution layer may have a footprint that covers the semiconductor die and a portion of the conductive traces. The strain redistribution layer may have a third elastic modulus that is less than the first elastic modulus and greater than the second elastic modulus.