公开(公告)号：US20190148268A1

公开(公告)日：2019-05-16

申请号：US16228378

申请日：2018-12-20

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Rajendra C. DIAS ,  Edvin CETEGEN ,  Lars D. SKOGLUND

IPC: H01L23/485 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L25/065

Abstract: Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.

公开(公告)号：US20170268971A1

公开(公告)日：2017-09-21

申请号：US15075086

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Ravindranth V. MAHAJAN ,  Rajendra C. DIAS ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Vijay SUBRAMANIA ,  Aleksandar ALEKSOV ,  Robert L. SANKMAN

IPC: G01N3/08

CPC classification number: G01N3/08 ,  G01N2203/0085 ,  G01N2203/0282

Abstract: Embodiments are generally directed to membrane test for mechanical testing of wearable devices. A mechanical testing system includes an actuation mechanism including a clamp to hold a membrane including stretchable electronics over an opening in the actuation mechanism, wherein the actuation mechanism is to apply pressure to the membrane through the opening; and a testing logic to control the application and release of pressure on the membrane by the actuation mechanism.

公开(公告)号：US20170268972A1

公开(公告)日：2017-09-21

申请号：US15075090

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Vijay Krishnan SUBRAMANIAN ,  Steven A. KLEIN ,  Rajendra C. DIAS ,  Pramod MALATKAR ,  Aleksandar ALEKSOV ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN

IPC: G01N3/08

CPC classification number: G01N3/08 ,  G01N2203/0085

Abstract: Embodiments are generally directed to a lateral expansion apparatus for mechanical testing of stretchable electronics. An embodiment of a system includes a compressible cylinder to apply mechanical forces to a stretchable electronics device by the compression and release of the compressible cylinder; a compression unit to compress to the compressible cylinder, wherein the compression unit is to apply a compression force in a direction along an axis of the compressible cylinder to generate lateral expansion of the compressible cylinder; and a testing logic to control compression and release of the compressible cylinder.

公开(公告)号：US20180019213A1

公开(公告)日：2018-01-18

申请号：US15546958

申请日：2015-03-11

Applicant: Intel Corporation

Inventor： Rajendra C. DIAS ,  Tatyana N. ANDRYUSHCHENKO ,  Mauro J. KOBRINSKY ,  Aleksandar ALEKSOV ,  David W. STAINES

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device and methods for forming a microelectronic device. In an embodiment, the microelectronic device includes a semiconductor die that has one or more die contacts that are each electrically coupled to a contact pad by a conductive trace. The semiconductor die may have a first elastic modulus. The microelectronic device may also include an encapsulation layer over the semiconductor die and the conductive trace. The encapsulation layer may have a second elastic modulus that is less than the first elastic modulus. The microelectronic device may also include a first strain redistribution layer within the encapsulation layer. The first strain redistribution layer may have a footprint that covers the semiconductor die and a portion of the conductive traces. The strain redistribution layer may have a third elastic modulus that is less than the first elastic modulus and greater than the second elastic modulus.

公开(公告)号：US20170269017A1

公开(公告)日：2017-09-21

申请号：US15075083

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Steven A. KLEIN ,  Rajendra C. DIAS ,  David C. MCCOY ,  Lars D. SKOGLUND ,  Vijay SUBRAMANIAN ,  Aleksander ALEKSOV ,  Pramod MALATKAR ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN

IPC: G01N27/20

CPC classification number: G01N27/20 ,  G01L1/04 ,  G01L1/18 ,  G01L1/22 ,  G01N3/08 ,  G01N2033/0078 ,  G01N2033/0095 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0062

Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.