公开(公告)号：US20230296371A1

公开(公告)日：2023-09-21

申请号：US17696980

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Jianyong MO ,  V Wade SINGLETON ,  Yiren WU ,  Liang ZHANG ,  David WASINGER

IPC: G01B11/06 ,  G01B11/30

CPC classification number: G01B11/06 ,  G01B11/30

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.