公开(公告)号：US20230236517A1

公开(公告)日：2023-07-27

申请号：US18130328

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Changhua LIU ,  Jianyong MO ,  Liang ZHANG

IPC: G03F7/20 ,  B81B1/00 ,  B81C1/00

CPC classification number: G03F7/70733 ,  B81B1/00 ,  B81C1/00111 ,  G03F7/201 ,  B81B2203/0361 ,  B81C2201/0159

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

公开(公告)号：US20210191282A1

公开(公告)日：2021-06-24

申请号：US16721786

申请日：2019-12-19

Applicant: Intel Corporation

Inventor： Changhua LIU ,  Jianyong MO ,  Liang ZHANG

IPC: G03F7/20 ,  B81B1/00 ,  B81C1/00

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

公开(公告)号：US20230296371A1

公开(公告)日：2023-09-21

申请号：US17696980

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Jianyong MO ,  V Wade SINGLETON ,  Yiren WU ,  Liang ZHANG ,  David WASINGER

IPC: G01B11/06 ,  G01B11/30

CPC classification number: G01B11/06 ,  G01B11/30

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

公开(公告)号：US20190293558A1

公开(公告)日：2019-09-26

申请号：US15934722

申请日：2018-03-23

Applicant: Intel Corporation

Inventor： Jianyong MO ,  Darren VANCE ,  Di XU ,  Liang ZHANG

IPC: G01N21/55 ,  G06T1/00 ,  G06T7/00

Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

公开(公告)号：US20250112136A1

公开(公告)日：2025-04-03

申请号：US18374937

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Bohan SHAN ,  Jesse JONES ,  Zhixin XIE ,  Bai NIE ,  Shaojiang CHEN ,  Joshua STACEY ,  Mitchell PAGE ,  Brandon C. MARIN ,  Jeremy D. ECTON ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Yuqin LI ,  Edvin CETEGEN ,  Jason M. GAMBA ,  Jacob VEHONSKY ,  Jianyong MO ,  Makoyi WATSON ,  Shripad GOKHALE ,  Mine KAYA ,  Kartik SRINIVASAN ,  Haobo CHEN ,  Ziyin LIN ,  Kyle ARRINGTON ,  Jose WAIMIN ,  Ryan CARRAZZONE ,  Hongxia FENG ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Gang DUAN ,  Dingying David XU ,  Hiroki TANAKA ,  Ashay DANI ,  Praveen SREERAMAGIRI ,  Yi LI ,  Ibrahim EL KHATIB ,  Aaron GARELICK ,  Robin MCREE ,  Hassan AJAMI ,  Yekan WANG ,  Andrew JIMENEZ ,  Jung Kyu HAN ,  Hanyu SONG ,  Yonggang Yong LI ,  Mahdi MOHAMMADIGHALENI ,  Whitney BRYKS ,  Shuqi LAI ,  Jieying KONG ,  Thomas HEATON ,  Dilan SENEVIRATNE ,  Yiqun BAI ,  Bin MU ,  Mohit GUPTA ,  Xiaoying GUO

IPC: H01L23/498 ,  H01L23/15

Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.

公开(公告)号：US20230358690A1

公开(公告)日：2023-11-09

申请号：US17737045

申请日：2022-05-05

Applicant: Intel Corporation

Inventor： Jianyong MO ,  Fan FAN ,  Liang ZHANG

IPC: G01N21/956 ,  H04N5/247 ,  G01N21/95

CPC classification number: G01N21/956 ,  H04N5/247 ,  G01N21/9501

Abstract: An optical inspection tool may include at least a first image capture unit and a second image capture unit for inspecting specimens having a substantially V-shaped grooves. The first image capture unit may be arranged in a first orientation so as to be directable towards a first angular surface of the V-shaped groove of each specimen. The second image capture unit may be arranged in a second orientation so as to be directable towards a second angular surface of the V-shaped groove of each specimen. The first image capture unit may be configured to capture images of defects and/or contamination on the first angular surface and the second image capture unit may be configured to capture images of defects and/or contamination on the second angular surface.

公开(公告)号：US20230314682A1

公开(公告)日：2023-10-05

申请号：US17706654

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Jacob CHESNA ,  Liang ZHANG ,  Jianyong MO ,  Fan FAN

IPC: G02B5/30 ,  G02B5/20 ,  G02B5/26 ,  G01L1/24

CPC classification number: G02B5/3066 ,  G02B5/305 ,  G02B5/208 ,  G02B5/26 ,  G01L1/248

Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

公开(公告)号：US20190339212A1

公开(公告)日：2019-11-07

申请号：US16473777

申请日：2017-03-17

Applicant: Intel Corporation

Inventor： Liang ZHANG ,  Jianyong MO ,  Darren A. VANCE ,  Di XU ,  Gregory S. CLEMONS ,  Robert F. WIEDMAIER

IPC: G01N21/956 ,  G01N21/88 ,  H04N5/225 ,  G06T7/00 ,  G02B3/14

Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.