公开(公告)号：US20220114121A1

公开(公告)日：2022-04-14

申请号：US17067334

申请日：2020-10-09

Applicant: Intel Corporation

Inventor： Anshuman THAKUR ,  Dheeraj SUBAREDDY ,  MD Altaf HOSSAIN ,  Ankireddy NALAMALPU ,  Mahesh KUMASHIKAR ,  Sandeep SANE

IPC: G06F13/20

Abstract: A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.