公开(公告)号：US20250006691A1

公开(公告)日：2025-01-02

申请号：US18345695

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： George Robinson ,  Mohamed Elhebeary ,  Divya Jain ,  Viet Chau ,  Zewei Wang ,  Mukund Ayalasomayajula ,  Suraj Maganty ,  Tingting Gao ,  Andrew Wayne Carlson ,  Khalid Mohammad Abdelaziz ,  Craig Jerome Madison ,  Edvin Cetegen ,  Joseph Petrini

IPC: H01L23/00

Abstract: Compliant inserts for pin dipping processes are disclosed herein. An example apparatus disclosed herein includes a pin array to transfer material to a package substrate of an integrated circuit package, a cover plate, an elastic insert to be disposed between the cover plate and the pin array.