公开(公告)号：US20230345677A1

公开(公告)日：2023-10-26

申请号：US18344620

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Shaorong Zhou ,  Prabhakar Subrahmanyam ,  Guocheng Zhang ,  Tejas Shah ,  Dongrui Xue

IPC: H05K7/20 ,  F28F9/007

CPC classification number: H05K7/20709 ,  F28F9/007

Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.