公开(公告)号：US20230345677A1

公开(公告)日：2023-10-26

申请号：US18344620

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Shaorong Zhou ,  Prabhakar Subrahmanyam ,  Guocheng Zhang ,  Tejas Shah ,  Dongrui Xue

IPC: H05K7/20 ,  F28F9/007

CPC classification number: H05K7/20709 ,  F28F9/007

Abstract: Compact rear mounted modular heat exchangers and related methods are disclosed herein. An example apparatus disclosed herein includes a heat exchanger having an air flow inlet and an air flow outlet, a holder frame to receive a component of a server chassis, and a bracket coupled to the holder frame, the bracket to retain the heat exchanger adjacent a rear of the server chassis.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.