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    Thermal control for processor-based devices
    4.
    发明授权
    Thermal control for processor-based devices 有权

    公开(公告)号：US11917790B2

    公开(公告)日：2024-02-27

    申请号：US16859202

    申请日：2020-04-27

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

    摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

    Reconfigurable cooling assembly for integrated circuitry
    5.
    发明授权
    Reconfigurable cooling assembly for integrated circuitry 有权

    公开(公告)号：US10930575B2

    公开(公告)日：2021-02-23

    申请号：US16337883

    申请日：2016-09-30

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Tong W. Chao ,  Stephanie L. Seaman ,  Ridvan A. Sahan ,  Ying-Feng Pang

    IPC分类号： H01L23/36 ,  H05K7/20 ,  H01L23/427 ,  H01L23/467

    摘要： Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.

    Jet vectoring fluid impingement cooling using pivoting nozzles
    9.
    发明授权
    Jet vectoring fluid impingement cooling using pivoting nozzles 有权

    公开(公告)号：US11439037B2

    公开(公告)日：2022-09-06

    申请号：US15986657

    申请日：2018-05-22

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy

    IPC分类号： H05K7/20 ,  H05K1/02

    摘要： Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

    SELF-HEALING, TARGET TEMPERATURE LOAD BALANCING, AND RELATED TECHNOLOGIES FOR HEAT EXCHANGER NETWORKS
    10.
    发明申请
    SELF-HEALING, TARGET TEMPERATURE LOAD BALANCING, AND RELATED TECHNOLOGIES FOR HEAT EXCHANGER NETWORKS 有权

    公开(公告)号：US20210307199A1

    公开(公告)日：2021-09-30

    申请号：US17342481

    申请日：2021-06-08

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam

    IPC分类号： H05K7/20 ,  G06F1/20

    摘要： Techniques for heat exchanger networks are disclosed. In the illustrative embodiment, several heat exchangers and several components to be cooled are connected together in a network. The flow of liquid coolant to each component and heat exchanger can be individually controlled. If a particular component needs more or less cooling, the flow rate of coolant through that component can be controlled. If a first component needs more cooling and a second component can operate with less cooling, coolant may be rerouted from the first component to the second component. Thus, target temperature load balancing can be achieved for all the components of the system. If a heat exchanger is faulty, it can be isolated, and a backup heat exchanger can be brought online, making the system self-healing and fault-tolerant. The faulty heat exchanger can then be repaired or replaced while the rest of the system is operational.