公开(公告)号：US12062592B2

公开(公告)日：2024-08-13

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/16157 ,  H01L2224/16227

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US20200373220A1

公开(公告)日：2020-11-26

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.