公开(公告)号：US12272614B2

公开(公告)日：2025-04-08

申请号：US16423700

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/36

Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

公开(公告)号：US20200373220A1

公开(公告)日：2020-11-26

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US12062592B2

公开(公告)日：2024-08-13

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/16157 ,  H01L2224/16227

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US11670569B2

公开(公告)日：2023-06-06

申请号：US16437872

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Peng Li ,  Bamidele Daniel Falola

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are channeled lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die between a lid and a package substrate. A bottom surface of the lid may include a channel that at least partially overlaps the die.

公开(公告)号：US20200381332A1

公开(公告)日：2020-12-03

申请号：US16423700

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC: H01L23/373 ,  H01L23/367

Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.