公开(公告)号：US11808988B2

公开(公告)日：2023-11-07

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth Abraham ,  Wesley Morgan ,  Eric Moret ,  Paul Diglio ,  Srikant Nekkanty

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20210223805A1

公开(公告)日：2021-07-22

申请号：US17133279

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Rodrigo De Oliveira Vivi ,  John Kelbert ,  David Lombard ,  Eric Moret ,  Mark Luckeroth ,  Brad Bittel ,  Phani Kumar Kandula

IPC: G05D23/19 ,  G06F9/48 ,  G06F9/50 ,  G05B15/02

Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

公开(公告)号：US12135569B2

公开(公告)日：2024-11-05

申请号：US17133279

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Rodrigo De Oliveira Vivi ,  John Kelbert ,  David Lombard ,  Eric Moret ,  Mark Luckeroth ,  Brad Bittel ,  Phani Kumar Kandula

IPC: G05D23/19 ,  G05B15/02 ,  G06F9/48 ,  G06F9/50

Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

公开(公告)号：US11762157B2

公开(公告)日：2023-09-19

申请号：US17482485

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Sufi Ahmed ,  Vineeth Abraham ,  Eric Moret ,  Paul Diglio

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/38

CPC classification number: G02B6/4239 ,  G02B6/3636 ,  G02B6/3839

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.