TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS

    公开(公告)号:US20250102744A1

    公开(公告)日:2025-03-27

    申请号:US18476089

    申请日:2023-09-27

    Abstract: Technologies for fiber array unit (FAU) lid designs are disclosed. In one embodiment, channels in the lid allow for suction to be applied to fibers that the lid covers, pulling the fibers into place in a V-groove. The suction can hold the fibers in place as the fiber array unit is mated with a photonic integrated circuit (PIC) die. Additionally or alternatively, channels can be on pitch, allowing for pulling the FAU towards a PIC die as well as sensing the position and alignment of the FAU to the PIC die. In another embodiment, a warpage amount of a PIC die is characterized, and a FAU lid with a similar warpage is fabricated, allowing for the FAU to position fibers correctly relative to waveguides in the PIC die. In another embodiment, a FAU has an extended lid, which can provide fiber protection as well as position and parallelism tolerance control.

    Apparatuses and methods for inspecting embedded features

    公开(公告)号:US12216301B2

    公开(公告)日:2025-02-04

    申请号:US17706654

    申请日:2022-03-29

    Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

    TECHNOLOGIES FOR BEAM EXPANSION IN MONOLITHIC GLASS SUBSTRATES

    公开(公告)号:US20250004203A1

    公开(公告)日:2025-01-02

    申请号:US18342289

    申请日:2023-06-27

    Abstract: Technologies for beam expansion in monolithic glass substrates are disclosed. In an illustrative embodiment, lenses in a glass substrate may be formed using a laser, either by changing the index of refraction or as part of a two-step etching process. A seam may be prepared and etched, separating the glass substrate into two components, one of which will be part of an optical plug and one of which will be part of an optical receptacle. The optical plug has a cavity into which an optical fiber can be placed. In use, the lens in the glass substrate of the optical plug collimates light from the optical fiber into a beam. When the optical plug is mated with the optical receptacle, the beam is aligned to the lens and a waveguide in the optical receptacle. The large size of the beam relaxes the alignment tolerance for the optical plug and receptacle.

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