公开(公告)号：US20230207493A1

公开(公告)日：2023-06-29

申请号：US17561578

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Veronica STRONG ,  Neelam PRABHU GAUNKAR ,  Brandon RAWLINGS ,  Gerogios C. DOGIAMIS

IPC: H01L23/64 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.