公开(公告)号：US09806392B2

公开(公告)日：2017-10-31

申请号：US14716101

申请日：2015-05-19

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Hanqiao Zhang ,  Kai Xiao ,  Beom-Taek Lee ,  John J. Abbott ,  Gary Charles

IPC: H01P3/08 ,  H04B3/32 ,  H05K1/02 ,  H05K9/00

CPC classification number: H01P3/081 ,  H04B3/32 ,  H05K1/02 ,  H05K1/0219 ,  H05K1/0233 ,  H05K3/3452 ,  H05K9/0022 ,  H05K2201/083

Abstract: Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.

公开(公告)号：US20160344085A1

公开(公告)日：2016-11-24

申请号：US14716101

申请日：2015-05-19

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Hanqiao Zhang ,  Kai Xiao ,  Beom-Taek Lee ,  John J. Abbott ,  Gary Charles

IPC: H01P3/08 ,  H05K9/00 ,  H04B3/32 ,  H01P11/00

CPC classification number: H01P3/081 ,  H04B3/32 ,  H05K1/02 ,  H05K1/0219 ,  H05K1/0233 ,  H05K3/3452 ,  H05K9/0022 ,  H05K2201/083

Abstract: Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与屏蔽线和/或互补去耦电容器和/或电磁吸收材料相关联的装置和方法。 在实施例中，装置可以包括具有接地平面的基板; 以及设置在基板上的第一和第二传输线。 此外，该装置可以包括由设置在第一和第二传输线之间并且不与接地平面耦合的电磁吸收材料构成的屏蔽线。 在实施例中，基板还可以包括具有多个边缘和多个间隔的电力平面; 设置在电源或接地平面上的多个去耦电容器; 和电磁吸收材料粘附到多个边缘并以多个间隔设置。 可以描述和/或要求保护其他实施例。