公开(公告)号：US09485854B2

公开(公告)日：2016-11-01

申请号：US14464279

申请日：2014-08-20

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Kai Xiao ,  Beom-Taek Lee ,  Boping Wu ,  Xiaoning Ye

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/09 ,  H05K3/30 ,  H05K1/18 ,  G06F1/16 ,  H01P1/26 ,  H01P5/16 ,  H04L25/03

CPC classification number: H05K1/023 ,  G06F1/16 ,  H01P1/268 ,  H01P3/08 ,  H01P5/16 ,  H01P11/003 ,  H01R12/737 ,  H01R13/6461 ,  H04L25/03006 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0268 ,  H05K1/09 ,  H05K1/181 ,  H05K3/22 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/10159 ,  H05K2201/10204

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及布置在印刷电路板（PCB）组件中的互连件中的电信号吸收的技术和配置。 在一种情况下，PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触，以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160057851A1

公开(公告)日：2016-02-25

申请号：US14464279

申请日：2014-08-20

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Kai Xiao ,  Beom-Taek Lee ,  Boping Wu ,  Xiaoning Ye

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/09 ,  H05K3/30 ,  H05K1/18 ,  G06F1/16

CPC classification number: H05K1/023 ,  G06F1/16 ,  H01P1/268 ,  H01P3/08 ,  H01P5/16 ,  H01P11/003 ,  H01R12/737 ,  H01R13/6461 ,  H04L25/03006 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0268 ,  H05K1/09 ,  H05K1/181 ,  H05K3/22 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/10159 ,  H05K2201/10204

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及布置在印刷电路板（PCB）组件中的互连件中的电信号吸收的技术和配置。 在一种情况下，PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触，以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09954332B2

公开(公告)日：2018-04-24

申请号：US15621688

申请日：2017-06-13

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Beom-Taek Lee

IPC: H01R33/92 ,  H01R12/73 ,  G06F1/18 ,  H01R25/00 ,  H05K7/14 ,  H05K1/14 ,  G11C5/04

CPC classification number: H01R33/92 ,  G06F1/185 ,  G11C5/04 ,  H01R12/737 ,  H01R25/00 ,  H05K1/14 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.

公开(公告)号：US09935353B2

公开(公告)日：2018-04-03

申请号：US14862159

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Gong Ouyang ,  Shaowu Huang ,  Kai Xiao

IPC: H01P3/08 ,  H01P11/00 ,  H01P3/04 ,  H05K1/02

CPC classification number: H01P3/081 ,  H01P3/04 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09036 ,  H05K2201/09872

Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

公开(公告)号：US20170295647A1

公开(公告)日：2017-10-12

申请号：US15621688

申请日：2017-06-13

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Beom-Taek Lee

IPC: H01L23/40 ,  H05K1/14

CPC classification number: H01R33/92 ,  G06F1/185 ,  G11C5/04 ,  H01R12/737 ,  H01R25/00 ,  H05K1/14 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.

公开(公告)号：US09814130B2

公开(公告)日：2017-11-07

申请号：US15138880

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  John J. Abbott

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H01R12/71 ,  H01R13/6598

CPC classification number: H05K1/024 ,  H01R12/71 ,  H01R13/6598 ,  H05K1/0234 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/10621 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed.

公开(公告)号：US09716361B2

公开(公告)日：2017-07-25

申请号：US15291993

申请日：2016-10-12

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Beom-Taek Lee

IPC: H01R33/92 ,  G06F1/18 ,  H01R12/73 ,  H05K1/14 ,  H05K7/14 ,  H01R25/00 ,  G11C5/04

CPC classification number: H01R33/92 ,  G06F1/185 ,  G11C5/04 ,  H01R12/737 ,  H01R25/00 ,  H05K1/14 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.

公开(公告)号：US09679854B2

公开(公告)日：2017-06-13

申请号：US14619052

申请日：2015-02-10

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Beom-Taek Lee

IPC: H01L23/538 ,  H04B3/36 ,  H04L25/20 ,  G06F1/18 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01L23/5382 ,  G06F1/185 ,  H01L23/5389 ,  H04B3/36 ,  H04L25/20 ,  H05K1/029 ,  H05K1/14 ,  H05K1/144

Abstract: The present disclosure is directed to a reconfigurable repeater system. A system may comprise a PCB to which devices are coupled. At least one communication channel may convey communications signals between the devices. At least one receptacle may also be coupled to the PCB and may intersect the at least one communication channel so as to separate the at least one communication channel into sections. Inserting at least one extender module into the at least one receptacle may couple the at least one extender module to the sections of the communication module. The at least one extender module may include at least one conductor to convey communication signals between the sections of the at least one communication channel. Another configuration of the at least one extender module may include a repeater to receive, amplify and transmit communication signals between the sections of the at least one communication channel.

公开(公告)号：US20170086288A1

公开(公告)日：2017-03-23

申请号：US14862159

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Gong Ouyang ,  Shaowu Huang ,  Kai Xiao

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/30 ,  H01P3/08 ,  H01P11/00

CPC classification number: H01P3/081 ,  H01P3/04 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09036 ,  H05K2201/09872

Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

公开(公告)号：US20170006698A1

公开(公告)日：2017-01-05

申请号：US15265704

申请日：2016-09-14

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Kai Xiao ,  Beom-Taek Lee ,  Boping Wu ,  Xiaoning Ye

IPC: H01P1/24 ,  H05K1/18 ,  H05K3/40 ,  H05K3/22 ,  H01P3/08 ,  H01P11/00 ,  H01R12/73 ,  H01R13/6461 ,  H05K1/02 ,  H01P1/26

CPC classification number: H05K1/023 ,  G06F1/16 ,  H01P1/268 ,  H01P3/08 ,  H01P5/16 ,  H01P11/003 ,  H01R12/737 ,  H01R13/6461 ,  H04L25/03006 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0268 ,  H05K1/09 ,  H05K1/181 ,  H05K3/22 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/10159 ,  H05K2201/10204

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及布置在印刷电路板（PCB）组件中的互连件中的电信号吸收的技术和配置。 在一种情况下，PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触，以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。