公开(公告)号：US20190206821A1

公开(公告)日：2019-07-04

申请号：US15859313

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Huxiao XIE ,  Amram EITAN ,  Xiao LU

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10165 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/13211 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13411 ,  H01L2224/13499 ,  H01L2224/16237 ,  H01L2224/165 ,  H01L2224/80051 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Apparatuses, systems, and methods associated with spacer elements for maintaining a distance between a substrate and component during reflow are disclosed herein. In embodiments, a substrate assembly may include a substrate and a component. The component may be coupled to the substrate via a solder joint, wherein the solder joint may include a spacer element and solder, the spacer element to maintain a distance between the substrate and the component. Other embodiments may be described and/or claimed.