公开(公告)号：US20240162134A1

公开(公告)日：2024-05-16

申请号：US18418154

申请日：2024-01-19

Applicant: Intel Corporation

Inventor： Xiao LU ,  Jiongxin LU ,  Christopher COMBS ,  Alexander HUETTIS ,  John HARPER ,  Jieping ZHANG ,  Nachiket R. RARAVIKAR ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Carl DEPPISCH ,  Mohit SOOD

IPC: H01L23/498 ,  B23K3/06 ,  H01L23/538

CPC classification number: H01L23/49833 ,  B23K3/0623 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

公开(公告)号：US20250106994A1

公开(公告)日：2025-03-27

申请号：US18373883

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Mukund AYALASOMAYAJULA ,  Jiaqi WU ,  Andrew W. CARLSON ,  Matthew MAGNAVITA ,  Zewei WANG ,  Xiao LU ,  George ROBINSON ,  Brian MOODY ,  Fatemeh RAHIMI ,  Chase Williams CHALLE ,  Prince Shiva CHAUDHARY ,  Dhruv Kishor MALDE ,  Mohamed ELHEBEARY

IPC: H05K1/11 ,  H01L23/00

Abstract: Embodiments include an apparatus with interconnects that have different structures. In an embodiment, the apparatus comprises a substrate and a first interconnect on the substrate, a second interconnect on the substrate, and a third interconnect on the substrate. In an embodiment, the first interconnect, the second interconnect, and the third interconnect are all different from each other.

公开(公告)号：US20210082798A1

公开(公告)日：2021-03-18

申请号：US16575307

申请日：2019-09-18

Applicant: Intel Corporation

Inventor： Xiao LU ,  Jiongxin LU ,  Christopher COMBS ,  Alexander HUETTIS ,  John HARPER ,  Jieping ZHANG ,  Nachiket R. RARAVIKAR ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Carl DEPPISCH ,  Mohit SOOD

IPC: H01L23/498 ,  B23K3/06 ,  H01L23/538

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

公开(公告)号：US20240304506A1

公开(公告)日：2024-09-12

申请号：US18117818

申请日：2023-03-06

Applicant: Intel Corporation

Inventor： Sangeon LEE ,  Tingting GAO ,  Xiao LU ,  Matthew MAGNAVITA ,  Khalid ABDELAZIZ

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/296 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49894

Abstract: Embodiments disclosed herein include socket interconnects with liquid metal. In an embodiment, a board comprises a substrate. A pad may be provided over the substrate. In an embodiment, a confinement layer is over the substrate, where the confinement layer defines a cavity over the pad. In an embodiment, a liquid metal is on the pad within the cavity. In an embodiment, a protective layer is provided over the liquid metal.

公开(公告)号：US20190206821A1

公开(公告)日：2019-07-04

申请号：US15859313

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Huxiao XIE ,  Amram EITAN ,  Xiao LU

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10165 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/13211 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13411 ,  H01L2224/13499 ,  H01L2224/16237 ,  H01L2224/165 ,  H01L2224/80051 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Apparatuses, systems, and methods associated with spacer elements for maintaining a distance between a substrate and component during reflow are disclosed herein. In embodiments, a substrate assembly may include a substrate and a component. The component may be coupled to the substrate via a solder joint, wherein the solder joint may include a spacer element and solder, the spacer element to maintain a distance between the substrate and the component. Other embodiments may be described and/or claimed.