公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC分类号： H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC分类号： H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US20170188468A1

公开(公告)日：2017-06-29

申请号：US15352264

申请日：2016-11-15

申请人： Panasonic Intellectual Property Managemtent Co., Ltd.

发明人： HIROHISA HINO ,  NAOMICHI OHASHI ,  YUKI YOSHIOKA ,  MASATO MORI ,  YASUHIRO SUZUKI

IPC分类号： H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H01L23/00

CPC分类号： H05K3/3489 ,  B23K35/24 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13023 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13387 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81905 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2201/0227 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/05432 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/066

摘要： Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

公开(公告)号：US07615476B2

公开(公告)日：2009-11-10

申请号：US11173939

申请日：2005-06-30

申请人： Fay Hua

发明人： Fay Hua

IPC分类号： H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1141 ,  H01L2224/11436 ,  H01L2224/1147 ,  H01L2224/1152 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13416 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/27436 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.

摘要翻译： 纳米尺寸金属颗粒复合材料包括粒径为约50纳米或更小的第一金属。 电线互连与回流纳米溶剂接触并具有与回流纳米溶剂相同的金属或合金组成。 还公开了使用回流纳米涂料组合物的微电子封装。 组装微电子封装的方法包括制备导线互连模板。 计算系统包括耦合到电线互连的纳米涂料组合物。

公开(公告)号：US20070001280A1

公开(公告)日：2007-01-04

申请号：US11173939

申请日：2005-06-30

申请人： Fay Hua

发明人： Fay Hua

IPC分类号： H01L23/02

CPC分类号： H01L23/49816 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1141 ,  H01L2224/11436 ,  H01L2224/1147 ,  H01L2224/1152 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13416 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/27436 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.

摘要翻译： 纳米尺寸金属颗粒复合材料包括粒径为约50纳米或更小的第一金属。 电线互连与回流纳米溶剂接触并具有与回流纳米溶剂相同的金属或合金组成。 还公开了使用回流纳米涂料组合物的微电子封装。 组装微电子封装的方法包括制备导线互连模板。 计算系统包括耦合到电线互连的纳米涂料组合物。

公开(公告)号：US20190206821A1

公开(公告)日：2019-07-04

申请号：US15859313

申请日：2017-12-29

申请人： Intel Corporation

发明人： Huxiao XIE ,  Amram EITAN ,  Xiao LU

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10165 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/13211 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13411 ,  H01L2224/13499 ,  H01L2224/16237 ,  H01L2224/165 ,  H01L2224/80051 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

摘要： Apparatuses, systems, and methods associated with spacer elements for maintaining a distance between a substrate and component during reflow are disclosed herein. In embodiments, a substrate assembly may include a substrate and a component. The component may be coupled to the substrate via a solder joint, wherein the solder joint may include a spacer element and solder, the spacer element to maintain a distance between the substrate and the component. Other embodiments may be described and/or claimed.

公开(公告)号：US20170033073A1

公开(公告)日：2017-02-02

申请号：US15302827

申请日：2015-04-10

申请人： Alpha Metals, Inc.

发明人： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Poulami Sengupta ROY ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC分类号： H01L23/00 ,  B23K35/02 ,  B22F1/00 ,  B23K35/36 ,  B23K35/365 ,  B22F1/02 ,  B23K1/00 ,  B23K35/30

CPC分类号： H01L24/29 ,  B22F1/0003 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  B23K2101/40 ,  B23K2103/56 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/27 ,  H01L2924/01074 ,  H01L2224/81 ,  H01L2224/11436 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2924/00

摘要： A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

摘要翻译： 一种烧结粉末，其特征在于，包括：平均最长尺寸为100nm〜50μm的第一种金属粒子。

公开(公告)号：US20160351529A1

公开(公告)日：2016-12-01

申请号：US14933951

申请日：2015-11-05

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  Intrinsiq Materials Ltd. ,  Technische Universitaet Chemnitz ,  SINTEF

发明人： Thomas J. Brunschwiler ,  Richard Dixon ,  Maaike M. Visser Taklo ,  Bernhard Wunderle ,  Kerry Yu ,  Jonas Zuercher

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/03 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/05647 ,  H01L2224/08238 ,  H01L2224/11822 ,  H01L2224/13005 ,  H01L2224/13019 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13347 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/1607 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2957 ,  H01L2224/29647 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/8184 ,  H01L2224/8384 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

摘要： A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

摘要翻译： 一种用于电耦合支柱的垫和前表面的方法，包括使所述前表面柱成形，所述前表面至少部分地具有凸表面，向所述前表面或所述垫施加悬架，其中所述悬架包括 载体流体，导电微粒和导电纳米颗粒，将衬垫的与衬垫相对的前表面布置在一定距离处，使得载体流体至少部分地桥接柱的前表面和衬垫之间的间隙，蒸发载体 流体，从而限制微粒和纳米颗粒，从而将纳米颗粒和微粒作为柱的前表面和垫之间的渗透路径布置，并且至少在纳米颗粒之间和/或之间烧结布置的纳米颗粒以形成金属键 纳米颗粒和柱或垫的前面。

公开(公告)号：US09230832B2

公开(公告)日：2016-01-05

申请号：US14195077

申请日：2014-03-03

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Stephan Paredes ,  Gerd Schlottig ,  Heiko Wolf

IPC分类号： H01L23/48 ,  H01L21/02 ,  H01L23/488 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/11001 ,  H01L2224/1131 ,  H01L2224/1141 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13499 ,  H01L2224/1601 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/81192 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/1152

摘要： A method for manufacturing a filled cavity between a first surface and a second surface. The steps of the method include: providing a first surface and a second surface; applying on the first surface and/or the second surface a filling material that has a carrier fluid and necking particles; providing spacer elements for defining a width of a cavity between the first and second surfaces; bringing the first and second surfaces together to deform the filling material such that at least one spacer element is held between the first and second surfaces; and removing the carrier fluid such that necking particles attach in a contact region of at least one spacer element with the first surface or the second surface to form necks.

摘要翻译： 一种用于在第一表面和第二表面之间制造填充空腔的方法。 该方法的步骤包括：提供第一表面和第二表面; 在第一表面和/或第二表面上施加具有载体流体和颈缩颗粒的填充材料; 提供用于限定第一和第二表面之间的腔的宽度的间隔元件; 使第一和第二表面一起使填充材料变形，使得至少一个间隔元件保持在第一和第二表面之间; 并且移除载体流体，使得颈缩颗粒附着在至少一个间隔元件与第一表面或第二表面的接触区域中以形成颈部。

公开(公告)号：US12119321B2

公开(公告)日：2024-10-15

申请号：US17947536

申请日：2022-09-19

申请人： EPISTAR CORPORATION

发明人： Shih-An Liao ,  Shau-Yi Chen ,  Ming-Chi Hsu ,  Chun-Hung Liu ,  Min-Hsun Hsieh

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

CPC分类号： H01L24/16 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L33/30 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/0612 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29324 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29313 ,  H01L2924/00014 ,  H01L2224/29309 ,  H01L2924/00014 ,  H01L2224/29311 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2224/29311 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00012

摘要： A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US20170028477A1

公开(公告)日：2017-02-02

申请号：US15302712

申请日：2015-04-10

申请人： Alpha Metals, Inc.

发明人： Rohan P. Setna ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Sutapa Mukherjee

IPC分类号： B22F9/24 ,  B22F1/02 ,  B22F9/04 ,  H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C09C1/62 ,  B22F1/00 ,  C09J1/00

CPC分类号： B22F9/24 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/04 ,  B22F2009/043 ,  B22F2301/10 ,  B22F2301/255 ,  C01P2004/20 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C09C1/62 ,  C09C1/622 ,  C09C1/627 ,  C09J1/00 ,  C09J9/02 ,  C09J11/04 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/29011 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2224/81

摘要： A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.

摘要翻译： 一种制造金属粉末的方法，包括：提供碱金属盐溶液; 使碱金属盐溶液与还原剂接触以从其中沉淀金属粉末; 并从溶剂中回收沉淀的金属粉末。