公开(公告)号：US20240321807A1

公开(公告)日：2024-09-26

申请号：US18123838

申请日：2023-03-20

Applicant: Intel Corporation

Inventor： Jonas CROISSANT ,  Xavier F. BRUN ,  Gustavo BELTRAN ,  Roberto SERNA ,  Ye Seul NAM ,  Timothy GOSSELIN ,  Jesus S. NIETO PESCADOR ,  Dingying David XU ,  John C. DECKER ,  Ifeanyi OKAFOR ,  Yiqun BAI

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L25/167 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/26145 ,  H01L2224/32145 ,  H01L2224/73204

Abstract: Embodiments disclosed herein include multi-die modules. In an embodiment, the multi-die module comprises a first die and a second die coupled to the first die. In an embodiment, the second die comprises a keep out zone that at least partially overlaps the first die. The multi-die module may further comprise an underfill between the first die and the second die. In an embodiment, the underfill is entirely outside the keep out zone, and an edge of the underfill facing the keep out zone is non-vertical.