公开(公告)号：US20240321807A1

公开(公告)日：2024-09-26

申请号：US18123838

申请日：2023-03-20

Applicant: Intel Corporation

Inventor： Jonas CROISSANT ,  Xavier F. BRUN ,  Gustavo BELTRAN ,  Roberto SERNA ,  Ye Seul NAM ,  Timothy GOSSELIN ,  Jesus S. NIETO PESCADOR ,  Dingying David XU ,  John C. DECKER ,  Ifeanyi OKAFOR ,  Yiqun BAI

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L25/167 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/26145 ,  H01L2224/32145 ,  H01L2224/73204

Abstract: Embodiments disclosed herein include multi-die modules. In an embodiment, the multi-die module comprises a first die and a second die coupled to the first die. In an embodiment, the second die comprises a keep out zone that at least partially overlaps the first die. The multi-die module may further comprise an underfill between the first die and the second die. In an embodiment, the underfill is entirely outside the keep out zone, and an edge of the underfill facing the keep out zone is non-vertical.

公开(公告)号：US20250106983A1

公开(公告)日：2025-03-27

申请号：US18373457

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Bohan SHAN ,  Kyle ARRINGTON ,  Dingying David XU ,  Ziyin LIN ,  Timothy GOSSELIN ,  Elah BOZORG-GRAYELI ,  Aravindha ANTONISWAMY ,  Wei LI ,  Haobo CHEN ,  Yiqun BAI ,  Jose WAIMIN ,  Ryan CARRAZZONE ,  Hongxia FENG ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Gang DUAN ,  Bin MU ,  Mohit GUPTA ,  Jeremy D. ECTON ,  Brandon C. MARIN ,  Xiaoying GUO ,  Ashay DANI

IPC: H05K1/02 ,  H05K1/03

Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.