公开(公告)号：US20220059467A1

公开(公告)日：2022-02-24

申请号：US17517472

申请日：2021-11-02

Applicant: Intel Corporation

Inventor： Yang CAO ,  Akm Shaestagir CHOWDHURY ,  Jeff GRUNES

IPC: H01L23/532 ,  H01L21/288 ,  H01L21/768

Abstract: Conducting alloys comprising cobalt, tungsten, and boron and conducting alloys comprising nickel, tungsten, and boron are described. These alloys can, for example, be used to form metal interconnects, can be used as liner layers for traditional copper or copper alloy interconnects, and can act as capping layers. The cobalt-tungsten and nickel-tungsten alloys can be deposited using electroless processes.