公开(公告)号：US20230294204A1

公开(公告)日：2023-09-21

申请号：US17698024

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Jeremy ECTON ,  Vinith BEJUGAM ,  Jefferson KAPLAN ,  Yonggang LI ,  Whitney BRYKS ,  Samuel GEORGE ,  Jeremy CROSS

IPC: B23K26/142 ,  B23K26/08 ,  B08B3/08

CPC classification number: B23K26/142 ,  B23K26/0823 ,  B08B3/08

Abstract: A method includes forming a solvent on a stage, and placing, on the solvent formed on the stage, a bottom surface of a substrate on which a residue is formed, so that the residue moves away from the bottom surface of the substrate into the solvent. The method further includes removing the substrate from the solvent into which the residue is moved.