公开(公告)号：US20230294204A1

公开(公告)日：2023-09-21

申请号：US17698024

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Jeremy ECTON ,  Vinith BEJUGAM ,  Jefferson KAPLAN ,  Yonggang LI ,  Whitney BRYKS ,  Samuel GEORGE ,  Jeremy CROSS

IPC: B23K26/142 ,  B23K26/08 ,  B08B3/08

CPC classification number: B23K26/142 ,  B23K26/0823 ,  B08B3/08

Abstract: A method includes forming a solvent on a stage, and placing, on the solvent formed on the stage, a bottom surface of a substrate on which a residue is formed, so that the residue moves away from the bottom surface of the substrate into the solvent. The method further includes removing the substrate from the solvent into which the residue is moved.

公开(公告)号：US20230361002A1

公开(公告)日：2023-11-09

申请号：US17738085

申请日：2022-05-06

Applicant: Intel Corporation

Inventor： Vinith BEJUGAM ,  Kristof DARMAWIKARTA ,  Yonggang LI ,  Samuel GEORGE ,  Srinivas PIETAMBARAM

IPC: H01L23/48 ,  H01L23/15 ,  H01L21/48 ,  H01L21/68

CPC classification number: H01L23/481 ,  H01L23/15 ,  H01L21/486 ,  H01L21/68

Abstract: The present disclosure is directed to semiconductor dies and methods that provide a glass substrate, a pulsed laser tool to produce a line-shaped modification to the glass substrate for forming a plurality of structures in the glass substrate. The pulse laser tool may be provided with a predetermined pattern for its movement. The predetermined pattern moves the pulsed laser tool in a series of single steps in a first axial direction and in a series of plural lateral steps in a second axial direction that is perpendicular to the first axial direction, in particular, the single step is followed by the plural lateral steps in a repeating sequence. The series of plural lateral steps form an assembly of line-shaped modifications in parallel rows on the glass substrate, and thereafter the plurality of structures may be formed from the parallel rows of line-shaped modifications in the glass substrate.