公开(公告)号：US20250006609A1

公开(公告)日：2025-01-02

申请号：US18883752

申请日：2024-09-12

Applicant: Intel Corporation

Inventor： Gang Duan ,  Ibrahim El Khatib ,  Jesse Cole Jones ,  Yi Li ,  Minglu Liu ,  Robin Shea McRee ,  Srinivas Venkata Ramanuja Pietambaram ,  Praveen Sreeramagiri

IPC: H01L23/498 ,  H01L23/15 ,  H01L25/065

Abstract: Systems, apparatus, articles of manufacture, and methods for package substrates with stacks of glass layers having different coefficients of thermal expansion are disclosed. An example package substrate includes: a first glass layer including a first through glass via extending therethrough, the first glass layer having a first coefficient of thermal expansion (CTE); and a second glass layer including a second through glass via extending therethrough, the second glass layer having a second CTE different from the first CTE, the first through glass via electrically coupled to the second through glass via.