公开(公告)号：US20240373556A1

公开(公告)日：2024-11-07

申请号：US18573521

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Gabriel Khouri ,  Jason Brand ,  John Hung ,  Timothy Rothman ,  Jaspal Singh Bhachu ,  Jiaqi Deng

IPC: H05K1/14 ,  H05K3/36

Abstract: Systems, apparatuses, and methods may provide for technology for a releasable spacer associating a first printed circuit board with a second printed circuit board. The releasable spacer includes a first portion and a second portion. The first portion of the releasable spacer is attached to the first printed circuit board. The second portion of the releasable spacer is attached to the second printed circuit board. The releasable spacer is oriented and arranged to selectively couple and decouple the first printed circuit board from the second printed circuit board. The releasable spacer is oriented and arranged to permit airflow between the first printed circuit board and the second printed circuit board when selectively coupled.