公开(公告)号：US20240373556A1

公开(公告)日：2024-11-07

申请号：US18573521

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Gabriel Khouri ,  Jason Brand ,  John Hung ,  Timothy Rothman ,  Jaspal Singh Bhachu ,  Jiaqi Deng

IPC: H05K1/14 ,  H05K3/36

Abstract: Systems, apparatuses, and methods may provide for technology for a releasable spacer associating a first printed circuit board with a second printed circuit board. The releasable spacer includes a first portion and a second portion. The first portion of the releasable spacer is attached to the first printed circuit board. The second portion of the releasable spacer is attached to the second printed circuit board. The releasable spacer is oriented and arranged to selectively couple and decouple the first printed circuit board from the second printed circuit board. The releasable spacer is oriented and arranged to permit airflow between the first printed circuit board and the second printed circuit board when selectively coupled.

公开(公告)号：US11385689B2

公开(公告)日：2022-07-12

申请号：US16343741

申请日：2016-10-26

Applicant: INTEL CORPORATION

Inventor： Jawad B. Khan ,  Andrew Warrack Morning-Smith ,  John Hung ,  Michael D. Nelson ,  Craig J. Jahne

IPC: G06F1/18 ,  F21V8/00 ,  G06F1/20 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

Abstract: An integrated electronic card front EMI cage and latch is described that is suitable for use in a data storage system. In an example a latch module for an electronic component housing has a latch housing having an arm with an attachment point to fasten the latch housing to an end of the housing and an EMI cage having a front body and a plurality of fingers extending from the front body, the front body being held to the end of the housing by the latch housing and the fingers being configured to be outside an exterior of the housing on at least two sides of the housing to block electromagnetic interference from passing along the at least two sides of the housing.

公开(公告)号：US12207409B2

公开(公告)日：2025-01-21

申请号：US17081502

申请日：2020-10-27

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Nan Allison Yao

IPC: H05K1/18 ,  H05K1/14 ,  G06F1/18

Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.

公开(公告)号：US20210120672A1

公开(公告)日：2021-04-22

申请号：US17133836

申请日：2020-12-24

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Paul Gwin ,  Nan Allison Yao

IPC: H05K1/14 ,  H05K7/20 ,  H05K1/02

Abstract: An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.

公开(公告)号：US20210045247A1

公开(公告)日：2021-02-11

申请号：US17081502

申请日：2020-10-27

Applicant: Intel Corporation

Inventor： John Hung ,  Andrew Morning-Smith ,  Kai-Uwe Schmidt ,  Nan Allison Yao

IPC: H05K1/18 ,  H01R12/73

Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.