公开(公告)号：US20190293707A1

公开(公告)日：2019-09-26

申请号：US16339834

申请日：2017-11-28

Applicant: Intel Corporation

Inventor： Erkan ACAR ,  Abram M. DETOFSKY ,  Jin PAN

IPC: G01R31/28

Abstract: In one embodiment, a device to test one or more electronic components comprises a first card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card and a second card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card. The at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first test device and the second test device that is not routed via a backplane. Other embodiments may be described.