公开(公告)号：US11145632B2

公开(公告)日：2021-10-12

申请号：US16636616

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Juan E. Dominguez ,  Hyoung Il Kim ,  Bilal Khalaf ,  John Gary Meyers

IPC: H01L25/10 ,  H01L23/31 ,  H01L25/065

Abstract: A high density die package configuration is shown for use on system boards. In one example, an apparatus includes a system board, a first package mounted to the system board, a second package mounted to the system board, and an interface package mounted between the first and the second package and coupled directly to the first package and to the second package through the respective first and second packages.