公开(公告)号：US20200381334A1

公开(公告)日：2020-12-03

申请号：US16423664

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC: H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

公开(公告)号：US11682605B2

公开(公告)日：2023-06-20

申请号：US16423664

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC: H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0655 ,  H05K1/18 ,  H01L24/09 ,  H01L24/17 ,  H05K2201/10734

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.