公开(公告)号：US20240006261A1

公开(公告)日：2024-01-04

申请号：US17855176

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Kevin Connolly ,  Robert Anderson

IPC: H01L23/34 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L25/0655 ,  H01L23/49822 ,  H01L23/49866

Abstract: A semiconductor package comprises two or more dies including at least one integrated circuit. The package can further include a heater element. The heater element can be configured to radiate heat, within one or more of a metal layer and a diffusion layer of at least one of the two or more dies of the semiconductor package. The package can further include controller interface configured to receive a heater enablement signal to initiate or terminate operation of the heater element. Other systems, apparatuses and methods are described.

公开(公告)号：US20230260864A1

公开(公告)日：2023-08-17

申请号：US17673487

申请日：2022-02-16

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Kevin Connolly

IPC: H01L23/34 ,  H01L27/06 ,  H01L27/02 ,  H01L25/18 ,  H01L21/8234 ,  G05D23/19 ,  H05B3/14 ,  G06F9/4401

CPC classification number: H01L23/345 ,  H01L27/0629 ,  H01L27/0211 ,  H01L25/18 ,  H01L21/823418 ,  G05D23/1917 ,  H05B3/148 ,  G06F9/4403

Abstract: Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.