公开(公告)号：US20210149736A1

公开(公告)日：2021-05-20

申请号：US17132508

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Vikram Dadwal

IPC: G06F9/50 ,  G06F15/80 ,  G06F11/30

Abstract: Methods, systems, apparatus, and articles of manufacture to extend the life of embedded processors are disclosed herein. Disclosed example apparatus include a policy selector to select a policy, based on input information. The apparatus extends an operating lifespan of a microprocessor having a plurality of cores. The apparatus also includes a cores partitioner to divide, based on the selected policy, the plurality of cores into subsets of cores, including a first subset and a second subset. A sensor monitors, based on the selected policy, at least one operational parameter of the cores, and a cores switcher switches a first core of the first subset of cores from active to inactive and to switch a second core of the second subset of cores from inactive to active based on the at least one operational parameter. The switches reduce an amount of degradation experienced by the first core and the second core.

公开(公告)号：US20230260864A1

公开(公告)日：2023-08-17

申请号：US17673487

申请日：2022-02-16

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Kevin Connolly

IPC: H01L23/34 ,  H01L27/06 ,  H01L27/02 ,  H01L25/18 ,  H01L21/8234 ,  G05D23/19 ,  H05B3/14 ,  G06F9/4401

CPC classification number: H01L23/345 ,  H01L27/0629 ,  H01L27/0211 ,  H01L25/18 ,  H01L21/823418 ,  G05D23/1917 ,  H05B3/148 ,  G06F9/4403

Abstract: Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.

公开(公告)号：US12288095B2

公开(公告)日：2025-04-29

申请号：US17132508

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Vikram Dadwal

IPC: G06F9/46 ,  G06F9/48 ,  G06F9/50 ,  G06F11/30

Abstract: Methods, systems, apparatus, and articles of manufacture to extend the life of embedded processors are disclosed herein. Disclosed example apparatus include a policy selector to select a policy, based on input information. The apparatus extends an operating lifespan of a microprocessor having a plurality of cores. The apparatus also includes a cores partitioner to divide, based on the selected policy, the plurality of cores into subsets of cores, including a first subset and a second subset. A sensor monitors, based on the selected policy, at least one operational parameter of the cores, and a cores switcher switches a first core of the first subset of cores from active to inactive and to switch a second core of the second subset of cores from inactive to active based on the at least one operational parameter. The switches reduce an amount of degradation experienced by the first core and the second core.

公开(公告)号：US20240006261A1

公开(公告)日：2024-01-04

申请号：US17855176

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Ganesh Kondapuram ,  Chetan Rawal ,  Kevin Connolly ,  Robert Anderson

IPC: H01L23/34 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L25/0655 ,  H01L23/49822 ,  H01L23/49866

Abstract: A semiconductor package comprises two or more dies including at least one integrated circuit. The package can further include a heater element. The heater element can be configured to radiate heat, within one or more of a metal layer and a diffusion layer of at least one of the two or more dies of the semiconductor package. The package can further include controller interface configured to receive a heater enablement signal to initiate or terminate operation of the heater element. Other systems, apparatuses and methods are described.