公开(公告)号：US20190043796A1

公开(公告)日：2019-02-07

申请号：US16017710

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Jun LIAO ,  Xiang LI ,  Kevin STONE ,  Tom DU ,  Tae-Young YANG ,  Ling ZHENG ,  James A. McCALL

IPC: H01L23/498 ,  H01R12/71 ,  H01R12/52 ,  H01R43/20 ,  H01R43/16 ,  H01R12/57

Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.