公开(公告)号：US11729902B2

公开(公告)日：2023-08-15

申请号：US16268318

申请日：2019-02-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William James Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01F5/04 ,  H04B1/40 ,  H01L25/16

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  G06F1/163 ,  G06F1/1626 ,  G06F2200/1631 ,  H01L25/16 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20250071885A1

公开(公告)日：2025-02-27

申请号：US18944243

申请日：2024-11-12

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US12200855B2

公开(公告)日：2025-01-14

申请号：US18418513

申请日：2024-01-22

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20240164010A1

公开(公告)日：2024-05-16

申请号：US18418513

申请日：2024-01-22

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H05K1/18

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  H04B1/40

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US11937367B2

公开(公告)日：2024-03-19

申请号：US18346313

申请日：2023-07-03

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  G06F1/1626 ,  G06F1/163 ,  G06F2200/1631 ,  H01L25/16 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20230354508A1

公开(公告)日：2023-11-02

申请号：US18346313

申请日：2023-07-03

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01F5/04

CPC classification number: H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  G06F1/1613 ,  H05K1/189 ,  H01F5/04 ,  H04B1/40

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20200253040A1

公开(公告)日：2020-08-06

申请号：US16268318

申请日：2019-02-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William James Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/50

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.