公开(公告)号：US20240105577A1

公开(公告)日：2024-03-28

申请号：US17954174

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Zhenguo Jiang ,  Zhiguo Qian ,  Jiwei Sun ,  Babita Dhayal

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49866

Abstract: Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members are disclosed. An example semiconductor die disclosed herein includes a semiconductor substrate, metal interconnects proximate a first side of the semiconductor substrate, a metal contact proximate a second side of the semiconductor substrate opposite the first side, a first grounding member extending from a grounding interconnect of the metal interconnects to a first distal point in the semiconductor substrate, and a second grounding member extending from the metal contact to a second distal point in the semiconductor substrate, the first distal point closer to the first side of the semiconductor substrate than the second distal point is to the first side of the semiconductor substrate.

公开(公告)号：US11107757B2

公开(公告)日：2021-08-31

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20200273776A1

公开(公告)日：2020-08-27

申请号：US16287728

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Cheng Xu ,  Junnan Zhao ,  Zhimin Wan ,  Ying Wang ,  Yikang Deng ,  Chong Zhang ,  Jiwei Sun ,  Zhenguo Jiang ,  Kyu-Oh Lee

IPC: H01L23/467 ,  H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H01L23/473 ,  H01L23/31 ,  H01L23/66

Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

公开(公告)号：US20200251411A1

公开(公告)日：2020-08-06

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/56 ,  H05K7/02 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H05K1/18 ,  H01L21/48 ,  H01L23/31

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US11729902B2

公开(公告)日：2023-08-15

申请号：US16268318

申请日：2019-02-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William James Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01F5/04 ,  H04B1/40 ,  H01L25/16

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  G06F1/163 ,  G06F1/1626 ,  G06F2200/1631 ,  H01L25/16 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US11482471B2

公开(公告)日：2022-10-25

申请号：US16287728

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Cheng Xu ,  Junnan Zhao ,  Zhimin Wan ,  Ying Wang ,  Yikang Deng ,  Chong Zhang ,  Jiwei Sun ,  Zhenguo Jiang ,  Kyu-Oh Lee

IPC: H01L23/46 ,  H01L23/467 ,  H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H01L23/473 ,  H01L23/66 ,  H01L23/31

Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

公开(公告)号：US10672693B2

公开(公告)日：2020-06-02

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H05K1/18 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20190304887A1

公开(公告)日：2019-10-03

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H05K1/18

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US11937367B2

公开(公告)日：2024-03-19

申请号：US18346313

申请日：2023-07-03

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  G06F1/1626 ,  G06F1/163 ,  G06F2200/1631 ,  H01L25/16 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20230354508A1

公开(公告)日：2023-11-02

申请号：US18346313

申请日：2023-07-03

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01F5/04

CPC classification number: H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  G06F1/1613 ,  H05K1/189 ,  H01F5/04 ,  H04B1/40

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.