-
公开(公告)号：US11476198B2
公开(公告)日：2022-10-18
申请号：US17024182
申请日：2020-09-17
Applicant: Intel Corporation
Inventor： Bok Eng Cheah , Jackson Chung Peng Kong , Jenny Shio Yin Ong , Seok Ling Lim , Kok Keng Wan
IPC: H01L23/538 , H01L23/00 , H01L21/50 , H01L21/60
Abstract: Disclosed embodiments include multi-level fan-out integrated-circuit package substrates that provide a low-loss path to active and passive devices, by shunting away from interconnects and inductive loops. The multi-level form factor of a molded mass, allows for the low-loss path.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
