公开(公告)号：US20220187549A1

公开(公告)日：2022-06-16

申请号：US17122352

申请日：2020-12-15

申请人： Intel Corporation

发明人： Hiroki TANAKA ,  Brandon C. MARIN ,  Kristof DARMAWKARTA ,  Robert Alan MAY ,  Sri Ranga Sai BOYAPATI ,  Srinivas V. PIETAMBARAM

IPC分类号： G02B6/42

摘要： Embodiments disclosed herein include photonics package with Faraday rotators to improve efficiency. In an embodiment, a photonics package comprises a package substrate and a compute die over the package substrate. In an embodiment, the photonics package further comprises a photonics die over the package substrate. In an embodiment, the compute die is communicatively coupled to the photonics die by a bridge in the package substrate. In an embodiment, the photonics package further comprises an integrated heat spreader (IHS) over the package substrate, and a Faraday rotator passing through the IHS and optically coupled to the photonics die.