公开(公告)号：US20230309220A1

公开(公告)日：2023-09-28

申请号：US17703704

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Yang JIAO ,  Kyle DAVIDSON ,  Srinivasa ARAVAMUDHAN ,  Jerry T. HARRIS

IPC: H05K1/03 ,  C08J5/24 ,  C08K5/56

CPC classification number: H05K1/0373 ,  C08J5/244 ,  C08J5/249 ,  C08K5/56 ,  H05K1/181

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substrate is coupled to the PCB, and a die is coupled to the package substrate.