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公开(公告)号:US20190208628A1
公开(公告)日:2019-07-04
申请号:US16056131
申请日:2018-08-06
申请人: Isola USA Corp.
CPC分类号: H05K1/0366 , C08J5/24 , C08J2300/22 , C08J2300/24 , H01B3/40 , H05K1/024 , H05K1/0248 , H05K1/0373 , H05K2201/0195 , Y10T428/24802 , Y10T428/2481 , Y10T428/24893 , Y10T428/24917 , Y10T428/24926
摘要: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
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2.
公开(公告)号:US20190203003A1
公开(公告)日:2019-07-04
申请号:US16009266
申请日:2018-06-15
发明人: CHIH-WEI LIAO , GUAN-SYUN TSENG , TSUNG-HSIEN LIN , JU-MING HUANG , CHEN-HUA YU
IPC分类号: C08J5/24 , C08L63/00 , C09D163/00 , C09D5/18 , B32B15/092 , H05K1/03 , H05K1/02 , H05K3/02
CPC分类号: C08J5/24 , B32B15/092 , B32B2457/08 , C08J2363/00 , C08J2421/00 , C08J2465/02 , C08L63/00 , C08L2201/02 , C08L2203/20 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L2207/53 , C09D5/18 , C09D163/00 , H05K1/024 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0212 , H05K2201/0227
摘要: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.
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公开(公告)号:US20190200455A1
公开(公告)日:2019-06-27
申请号:US16286237
申请日:2019-02-26
申请人: Ajinomoto Co., Inc.
发明人: Shigeo NAKAMURA , Shiro TATSUMI , lkumi SAWA
IPC分类号: H05K1/03 , H05K3/46 , C08L63/00 , H05K3/22 , H01L23/14 , H01L21/48 , H05K3/00 , B32B27/00 , H01L21/683 , H01L23/498
CPC分类号: H05K1/0373 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/00 , B32B27/08 , B32B27/10 , B32B27/18 , B32B27/205 , B32B27/26 , B32B27/28 , B32B27/281 , B32B27/285 , B32B27/288 , B32B27/32 , B32B27/325 , B32B27/36 , B32B27/365 , B32B2264/02 , B32B2264/0207 , B32B2264/0264 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/7265 , B32B2307/732 , B32B2457/08 , C08G59/621 , C08G59/686 , C08L63/00 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/145 , H01L23/49894 , H01L2221/68345 , H05K3/0011 , H05K3/22 , H05K3/4038 , H05K3/4673 , H05K3/4682 , H05K2201/0209 , H05K2201/0212 , H05K2203/06
摘要: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.
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公开(公告)号:US20190191559A1
公开(公告)日:2019-06-20
申请号:US16029114
申请日:2018-07-06
CPC分类号: H05K1/0366 , H05K1/0284 , H05K1/0373 , H05K1/09 , H05K1/11 , H05K1/115 , H05K1/14 , H05K3/0014 , H05K3/429 , H05K3/4664 , H05K2203/0278 , H05K2203/1453
摘要: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.
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公开(公告)号:US10081585B2
公开(公告)日:2018-09-25
申请号:US14897864
申请日:2014-02-21
申请人: DIC Corporation
发明人: Yutaka Satou , Ayumi Takahashi
IPC分类号: C07C39/14 , C07C37/14 , H01L23/29 , C08G61/02 , C08G8/02 , C08L61/16 , C08K3/04 , C08K7/18 , H05K1/03 , H05K1/09 , C08G59/62 , C08L63/00 , C08L91/06 , C07C37/00 , C08L65/00
CPC分类号: C07C39/14 , C07C37/14 , C08G8/02 , C08G59/621 , C08G61/02 , C08K3/04 , C08L61/16 , C08L63/00 , C08L65/00 , C08L91/06 , H01L23/293 , H01L23/295 , H01L2924/0002 , H05K1/0373 , H05K1/09 , H01L2924/00
摘要: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.
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公开(公告)号:US20180270951A1
公开(公告)日:2018-09-20
申请号:US15920594
申请日:2018-03-14
申请人: IBIDEN CO., LTD.
CPC分类号: H05K1/113 , H05K1/0206 , H05K1/0207 , H05K1/0373 , H05K3/061 , H05K3/14 , H05K3/18 , H05K3/24 , H05K3/424 , H05K3/429 , H05K3/4682 , H05K2201/09827 , H05K2203/0152 , H05K2203/0278 , H05K2203/0307 , H05K2203/0723 , H05K2203/107
摘要: A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.
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7.
公开(公告)号:US20180270945A1
公开(公告)日:2018-09-20
申请号:US15542766
申请日:2016-01-05
发明人: Hiroaki TAKAHASHI , Kiyotaka KOMORI , Masaya KOYAMA , Jun TOCHIHIRA , Ryu HARADA
CPC分类号: H05K1/024 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/20 , B32B27/32 , B32B2270/00 , B32B2307/202 , B32B2307/206 , B32B2457/08 , H05K1/036 , H05K1/0373 , H05K1/0393 , H05K3/022 , H05K3/4673 , H05K2201/0133 , H05K2201/0141 , H05K2201/0158 , H05K2201/0195
摘要: A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.
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公开(公告)号:US20180213637A1
公开(公告)日:2018-07-26
申请号:US15925990
申请日:2018-03-20
发明人: Tomoya HOSODA , Toru SASAKI , Nobutaka KIDERA , Tatsuya TERADA
CPC分类号: H05K1/0271 , B32B7/02 , B32B27/30 , H05K1/024 , H05K1/036 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/16 , H05K3/0011 , H05K3/0014 , H05K3/0055 , H05K3/422 , H05K3/427 , H05K2201/015 , H05K2201/0154 , H05K2201/068 , H05K2201/10098 , H05K2203/0789 , H05K2203/095
摘要: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C., and a second conductor layer 14, applying, to an inner wall surface 20a of the hole 20, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer 22 on the inner wall surface 20a of the hole 20.
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9.
公开(公告)号:US20180170005A1
公开(公告)日:2018-06-21
申请号:US15580272
申请日:2016-06-20
发明人: HIROSUKE SAITO , HIROAKI FUJIWARA
CPC分类号: B32B15/06 , B32B27/302 , C08F2/44 , C08F36/04 , C08J5/10 , C08J5/24 , C08J2371/12 , C08K5/5397 , C08K5/5399 , C08L9/06 , H05K1/0373 , H05K2201/012 , H05K2203/122
摘要: A curable composition includes a radically polymerizable compound having a carbon-carbon unsaturated double bond in a molecule, and an insoluble phosphorus compound insoluble in the radically polymerizable compound. The insoluble phosphorus compound includes a phosphine oxide compound having two or more diphenylphosphine oxide groups in a molecule.
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10.
公开(公告)号:US20180147982A1
公开(公告)日:2018-05-31
申请号:US15674244
申请日:2017-08-10
CPC分类号: B60Q9/00 , B29C35/0805 , B29C44/12 , B29C45/14065 , B29C2035/0838 , B29K2105/04 , B29K2105/16 , B29K2507/04 , B29K2995/0005 , B29L2031/3014 , B29L2031/3026 , B60N2/0228 , B60N2/797 , B60R13/0243 , B60R13/0256 , B60R16/005 , B60R2013/0287 , G01N27/041 , G08B21/182 , H01H13/702 , H01H13/785 , H03K17/964 , H03K17/9645 , H05K1/0373 , H05K1/165 , H05K1/167 , H05K3/105 , H05K2201/026 , H05K2201/0323 , H05K2201/10053 , H05K2201/10098 , H05K2203/107 , H05K2203/1136
摘要: A component for the passenger compartment of a motor vehicle includes a rigid supporting body, made of plastic material, an outer upholstery skin, made of plastic material, and a padding body made of foamed plastic material, which is set between the rigid body and the outer upholstery skin. The rigid body and the outer skin have portions formed by a polymeric material with carbon-based nanofillers, which have respective inner surfaces facing the padding body, which include one or more paths where said polymeric material with carbon-based nanofillers has been rendered electrically conductive by laser irradiation to define one or more electrical circuits, and one or more piezoresistive areas where the polymeric material has been rendered piezoresistive by laser irradiation to define one or more electrical switches, which can be activated by exerting a localized pressure on the outer upholstery skin.
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