公开(公告)号：US20240288850A1

公开(公告)日：2024-08-29

申请号：US18571672

申请日：2022-04-26

Applicant: Intel Corporation

Inventor： Long SHENG ,  Liang CHEN ,  Tao ZHOU ,  Shuping HAN ,  Yan WANG ,  Chandra KATTA ,  Vikram SURESH ,  Chong HAN ,  He HAN ,  Tatt Hee OONG ,  Chee Hung CHIAN ,  Yi HAN ,  Hao CHEN

IPC: G05B19/4155 ,  H05K7/20

CPC classification number: G05B19/4155 ,  H05K7/20209 ,  G05B2219/50333

Abstract: Various embodiments are directed to frequency and voltage tuning for systems with multiple application-specific integrated circuits (ASICs) and disclosed herein may be applied to multi-AIC systems in a variety of applications, such as high-performance computing, artificial intelligence, graphics applications, and cryptocurrency or blockchain mining functions.

公开(公告)号：US20160283438A1

公开(公告)日：2016-09-29

申请号：US15038710

申请日：2013-12-23

Applicant: Hu Tiger CHEN ,  Liang CHEN ,  Chunxiao LIN ,  Sai LUO ,  Hai Ge TIAN ,  Rui Gang WANG ,  Tin Fook NGAI ,  INTEL CORPORATION

Inventor： Hu Tiger CHEN ,  Liang CHEN ,  Chunxiao LIN ,  Sai LUO ,  Hai Ge TIAN ,  Rui Gang WANG ,  Tin-Fook NGAI

IPC: G06F15/80 ,  G06F13/40

CPC classification number: G06F15/80 ,  G06F13/4027 ,  G06F13/4068 ,  G06F15/7807 ,  Y02D10/12 ,  Y02D10/13 ,  Y02D10/14 ,  Y02D10/151

Abstract: A processing device includes a first processor module comprising a first core designed according to a first instruction set (ISA), and a second processor module comprising a second core designed according to a second ISA. The first and second processor modules are fabricated on a same die.

Abstract translation: 一种处理装置包括：第一处理器模块，包括根据第一指令集（ISA）设计的第一核心;以及第二处理器模块，包括根据第二ISA设计的第二核心。 第一和第二处理器模块被制造在相同的芯片上。